Job Details

Samsung Electronics America, Inc.
  • Position Number: 2485610
  • Location: Austin, TX
  • Position Type: Computer and Information Technology

Photolithography Equipment Engineer

Position Summary

Samsung Austin Semiconductor is one of the most advanced semiconductor manufacturing facilities in the world with more than 3,000 employees and 2.45 million square feet of floor space. Samsung Austin Semiconductor has broad semiconductor process technology offerings serving customers in various application areas including mobile, consumer, networking/high performance computing, Internet of Things, RF and automotive. Since 1996, SAS has invested approximately $17 billion in its Austin, TX campus, making it one of the largest direct foreign investments in United States history. Samsung Austin Semiconductor is a US-based subsidiary of Samsung Electronics Co., Ltd. The Austin facility is one of the few semiconductor plants the company has outside South Korea. Visit

SAS is focused on being the World's Best Foundry product supplier.

Role and Responsibilities

  • Samsung Austin Semiconductor (SAS) is one of the most advanced semiconductor manufacturing facilities in the United States. Owned by Samsung Electronics Corporation Ltd., SAS manufactures logic components for digital services, personal computers, mobile phones, workstations and servers. Since 1997, SAS has been at the forefront of manufacturing technology, enabling the world's digital devices to operate at the highest performance.
  • The Photolithography department is focused on delivering solutions by developing 24x7x365 teams of elite, fab-oriented, excursion-free, safety and quality minded members. As part of the Photo Operations Equipment Engineering team, you will work together to support one another and our customers regardless of organizational boundaries.
  • Coordinate Samsung internal, external and multiple vendor resources to provide optimum manufacturing support on assigned equipment. Including equipment installation/de-installation projects, and standard maintenance activities.
  • Drive hard down and atypical tool recovery efforts with hands on engineering and complex maintenance activities.
  • Investigate, troubleshoot and provide technical solutions to equipment related defect, quality and yield problems.
  • Analyze and report tool performance data, including availability, mean time to repair, mean time between failures, particle and defect trends, maintenance success, and similar metrics for assigned equipment.
  • Innovate & implement new techniques and systems, to improve assigned metrics: safety, cost, wafer outputs, equipment availability, equipment efficiency, product defectivity, overall tool quality, and other metrics assigned. Document these improvements through Best Known Methods, Standard Operating Procedures, action trackers and weekly reports.
  • Support new device introduction, technology transfer from sister factories.
  • Attending and contributing in daily tactical meetings with internal and external teams about photolithography equipment. Attending strategic cross functional weekly meetings regarding equipment metrics and contribute to improvement plans.
  • Provide weekend and night shift equipment coverage as needed (~ 12 weeks a year). You will be responsible for multiple tools on the weekend larger than your normal scope and required to make tactical decisions based on your assessment of the daily operations environment in order to successfully achieve KPI.
  • Prioritize your work in alignment with the photo departments level priorities, and understand your part in achieving company goals.
  • Assist other team members and areas when possible to help meet production goals.

Skills and Qualifications

  • 4 years of college in related field.
  • Requires 2+ years of semiconductor equipment ownership or similar manufacturing bottleneck equipment ownership experience.
  • Experience on one or more of the following types of semiconductor equipment: ASML, Canon, Nikon, TEL, SEMES.
  • Understanding of semiconductor wafer processing fundamentals and photolithography.
  • Excellent written and verbal communication skills.
  • Ability to deliver and present reports of a technical nature on short notice
  • Familiarity with SPC, FMEA, FDC, yield analysis and other standard engineering and manufacturing practices.
  • Proficient with data analysis tools, such as jump, matlab and complex spreadsheets.
  • Problem Solving: Identifies complex problems and reviews related information to develop and evaluate options and implement solutions. Experience using KT analysis techniques, 5 Whys, Fishbone diagrams, and flow charts.
  • Judgment and Decision Making: Considers the relative costs and benefits of potential actions to choose the most appropriate solution for direct reports and equipment.
  • Time Management: Schedules and prioritizes time and activities to accomplish goals and meet deadlines.
  • Coordination: Gets members of a group to work together to accomplish tasks.
  • Teamwork and Communication: Works well in a team environment and effectively communicates throughout the department and organization.
  • Positive attitude and work ethic: Work Environment. Most work is performed in an office environment and 2 hours a day in the semiconductor fabrication facility where a cleanroom gown is required.
  • Physical Demands: While performing the duties of this job, the employee is regularly required to sit. The employee frequently is required to walk; use hands to finger, handle or feel; reach with hands and arms; and talk or hear. The employee is occasionally required to stand. The employee must frequently lift or move objects up to 10 pounds and occasionally lift or move objects up to 25 pounds. Specific vision abilities required by this job include close vision, distance vision, color vision and ability to adjust focus.
  • Position type/ Expected Hours of Work: Regular Full Time.
  • 1st shift; Daily 7:45 am start time
  • Intermittent weekend coverage requ.ired; 2nd shift/night shift engagement as business need requires.
  • Travel: No regular travel requirements. Some occasional travel may be necessary to support priority projects.

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Application Procedures
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